Archive for Intel
Aug
04
Intel’s 6-Core Xeon (Westmere) Spotted
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We now know a little more about Intel’s upcoming six-core Xeon CPU codenamed Westmere thanks to these leaked engineering samples. Still classified as a Core i7 chip, the Xeon W5590 runs six 2.4GHz cores with 12MB of shared Level 3 cache and and 256KB of Level 2 cache per core. Hyperthreading support enables two program threads to run on each core, meaning that the whole system effectively delivers 12 cores. Price details have not been announced, but Westmere is officially due out in the first half of 2010.
Jul
29
New Atom Architecture Pine Trail On Schedule In 2009
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The ever-entertaining Mooley Eden, Intel’s General Manager of Mobile Platform Group, wants you to know as succinctly as possible that the rumors of Atom evolution Pine Trail’s delay have been greatly exaggerated. “Pine Trail is on schedule. You can quote me on that… The three chip solution down to two chip solution [is] coming this year.” Now how about a hint as to where we’ll first see this chip, eh Eden?
Jun
17
Intel Explains ‘Simplified’ Core i3, i5, i7 Brand Structure
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Wisely, Intel has decided to simplify their overly complex brand structure by boiling things down into three main categories: “entry-level (Intel Core i3), mid-level (Intel Core i5), and high-level (Intel Core i7).”
Intel spokesman Bill Calder notes:
…we are focusing our strategy around a primary ‘hero’ client brand which is Intel® Core™. Today the Intel Core brand has a mind boggling array of derivatives (such as Core™2 Duo and Core 2 Quad, etc). Over time those will go away and in its place will be a simplified family of Core processors spanning multiple levels: Intel® Core™ i3 processor, Intel® Core™ i5 processor, and Intel® Core™ i7 processors. Core i3 and Core i5 are new modifiers and join the previously announced Intel Core i7 to round out the family structure. It is important to note that these are not brands but modifiers to the Intel Core brand that signal different features and benefits. For example, upcoming processors such as Lynnfield (desktop) will carry the Intel Core brand, but will be available as either Intel Core i5 or Intel Core i7 depending upon the feature set and capability. Clarksfield (mobile) will have the Intel Core i7 name.
Pentium, Celeron and Atom aren’t going anywhere, but for their premium Core brand, chips will be broken down into the three categories above. Calder also stated that this transition will take time—and probably won’t be implemented fully until sometime in 2010. The new system is not all that great to be honest, but it least it officially confirms that mobile chips will be called Core i7.
May
27
New Intel Core i7 CPUs Show Up Unannounced
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Intel’s Core i7 has become somewhat of a mainstay in the most recent wave of gaming rigs, but it’s been quite awhile (in processor years, anyway) since we’ve seen any new siblings join the launch gang. We’d heard faint whispers that a new crew was set to steal the stage on May 31st, and those rumors are looking all the more likely now that a few heretofore unheard of chips have appeared online. The 3.06GHz Core i7 950 is shown over at PCs For Everyone with 8MB of shared L3 cache and a $649 price tag, and it’s expected that said chip will replace the aging Core i7 940. Moving on up, there’s the luscious 3.33GHz Core i7 Extreme 975, which is also listed with 8MB of shared L3 cache but packs a staggering price tag well above the $1,100 mark. If all this pans out, this CPU will replace the Core i7 Extreme 965 as Intel fastest Core i7 product. Just a few more days to wait, right?
Apr
10
New Intel’s Easy for Your Grandma to Understand Processor Badges
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They’re designed to be simple to understand for regular people, so you don’t need these explained, right?
It’s easy, really: Black is for high-end (except, uh, the weak Atom also uses a black background, oops); blue is for mainstream, white is for cheaper chips like Celeron and Pentium (expect when it’s Centrino and Centrino 2). Okay, not so great on the colors. Let’s move on!
Just like your favorite restaurant, now they have star ratings. Five stars is for high end like Core i7, one star is for not-so-great like Celeron. The issue for regular people is that the star rating appears on a computer’s sales card (not the chip logo itself) and only describes the chip, not the whole computer. “Hey this computer’s got four stars? That’s pretty good!” Anyone else feel a Microsoft ad coming on?
Apr
08
Intel Atom Turns One With New 2GHz, 1.2GHz Models
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It’s been a year since Intel fired the opening salvo against regular-size laptopping with its Atom processor. Now, the Z series gets its expected speed bump, and at the bottom end, a low-power MID-oriented model.
The Atom Z550 takes the Atom to heretofore unseen speeds of 2.0GHz, while maintaining a sub-3W power envelope. Obviously, this speed gain is a good thing, but our enthusiasm is dampered by the fact that this is based on familiar, unexciting tech; the Z series “Silverthorn” processors may be power-thrifty and capable, but their architecture hasn’t changed much with the new processors. A speed bump and the addition of hyperthreading are appreciated, but these marginal boosts won’t be game changers.
On the other side of the performance spectrum, the Z515 winds the processor clock way down. Intel claims that Intel Performance Burst Technology “enables the processor to run at 1.2GHz when performance is needed”, scaling up from an idle speed of 800MHz. The Z series processors were originally intended for low power applications like MIDs, and although the Z550 will likely make its way to netbooks, the Z515 is comfortable right where it is, thanks.
But as I’ve said, these aren’t a huge step for Intel, and won’t make a massive difference to consumers. For that, you’ll have to wait for the new Moorestown platform, based around the 45nm “Lincroft” Atoms, a prototype of which Intel broke out at the conference, just to tease us. Full presser below.
Intel Developer Forum: 1-Year Intel® AtomTM Processor Anniversary
Brings New Chips, Demonstration of Next-Generation Device
Intel Executives Share Vision, Updates at Beijing Tech Event
BEIJING, April 8, 2009 – Celebrating the 1-year anniversary of Intel Corporation’s introduction of its wildly popular Intel® AtomTM processor family, Anand Chandrasekher, Intel senior vice president and general manager of the Ultra Mobility Group, introduced two new processors for Mobile Internet Devices (MIDs) and several other milestones during his keynote today at the Intel Developer Forum in Beijing.
Chandrasekher was joined by two other Intel executives, Craig Barrett and Pat Gelsinger, whose keynotes focused on the company’s directions for the next year and beyond. The event, held at the Renaissance Beijing Capital Hotel, was geared toward the Chinese market in support of local innovation and Intel’s industry leadership in the region.
Mobility Keynote
During his keynote, titled “Mobility’s Next Wave of Growth,” Chandrasekher demonstrated the first live demo of Intel’s next-generation Atom-based MID platform, codenamed “Moorestown.” Chandrasekher provided a sneak peek into the low-power innovation of the platform by showcasing a greater than 10x idle power reduction compared to today’s Atom-based platform in a side-by-side demo. This dramatic reduction is made possible through a combination of new power management techniques, a new partition optimized for the MID segments and Intel’s Hi-k 45nm manufacturing process.
Due in 2010, the Moorestown platform is comprised of a System on Chip (codenamed “Lincroft”) that integrates a 45nm Intel® Atom processor core, graphics, video and memory controller, and a companion input/output (I/O) hub (codenamed “Langwell”). The platform will be accompanied by a new Moblin software version that is optimized to enable the rich, interactive, PC-like Internet experience along with cellular voice capabilities.
Intel also announced two new Atom processors for MIDs: the Z550 and Z515. The Z550 extends the performance of the MID product line to 2GHz with Intel Hyperthreading technology support, setting a new standard for the highest performance processor in the under-3-watt power envelope. The Z515 incorporates the new Intel® Burst Performance Technology (Intel BPT), which enables the processor to run at 1.2GHz when performance is needed in existing small and sleek MID form factors.
These new Atom processors further extend customer choices to enable the best Internet experience in pocketable MIDs. Chandrasekher also announced several new MID designs for the China market.
Discussing Intel Centrino 2-based laptops, Chandrasekher pointed out additional OEMs choosing to include Intel ultra low-voltage processors to create ultra-thin laptop designs that are less than 1 inch thick. While lighter in size and weight, these notebooks still offer great performance and battery life consumers have come to expect. Chandrasekher then described the next-generation processors for laptops based on the Nehalem architecture that will be available in the second half of this year on the “Calpella” platform. These processors will be more powerful then their predecessors by including such technologies as Intel Hyper-Threading Technology and Intel Turbo Boost Technology.
Enterprise Keynote
During his keynote, titled “IA: The Intelligent Architecture Investment,” Pat Gelsinger, Intel senior vice president and general manager of the Digital Enterprise Group, discussed Intel’s latest client, server and embedded product lines, and gave developers an update on the latest programming tools available for the Larrabee architecture.
Intel’s complete Intel Architecture future product roadmap was also revealed. Gelsinger said the “Nehalem” microarchitecture has received worldwide acclaim with the Core® i7 processor launch in 2008 and the recent Nehalem-based Xeon 5500 series introduction. The Xeon 5500 series combines the world’s leading processor microarchitecture with a new memory and I/O subsystem, QuickPath Interconnects and Intelligent Power Technology to control power consumption.
Gelsinger said Intel and the industry now look to adopting more mainstream PC and laptop versions of the Nehalem microarchitecture, including 32nm manufactured versions with on-processor graphics, as well the multi-socket Nehalem EX server processor, all in production in the second half of 2009. The future Nehalem-EX processor will provide eight cores for the multiprocessor “intelligent server” market.
For embedded computers, Gelsinger discussed a range of recently announced Atom processor solutions with industrial temp for applications such as in-vehicle infotainment and industrial automation. He also disclosed, for the first time ever, the Nehalem-EP based processor (codenamed “Jasper Forest”) that is specifically designed to deliver increased compute density and integration required for embedded and storage applications.
Gelsinger also addressed Larrabee, which is Intel’s first many-core architecture designed for high throughput applications and features a programmable graphics pipeline that enables developer freedom. The Intel executive discussed availability of a C++ Larrabee Prototype Library and a future parallel programming solution based on “Ct” technology. The first Larrabee discrete graphics products are due in the late 2009/2010 timeframe.
Vision & Leadership Keynote
During the conference’s opening keynote, Intel Chairman Craig Barrett described how technology is a tool for improving education, health care, economic development and the environment. He challenged the developer community to use its collective technology expertise to develop solutions that tackle these challenges.
“Nothing beats investing in good people and good ideas,” said Barrett, whose conclusions are drawn from observations from trips to more than 30 countries a year. “Public-private collaboration is fundamental in driving solutions that confront global challenges.”
Barrett announced that Intel had selected the four winners of the INSPIRE•EMPOWER Challenge he launched last August. The winners will each receive $100,000 to further fund their innovative solutions that apply technology to address unmet needs related to education, health care, economic development and the environment.
The INSPIRE•EMPOWER Challenge winners are: Bibek Chapagain of Winrock International in Kathmandu, Nepal; Daniel Fletcher of the University of California, Berkeley; Eric Morrow of the Maendeleo Foundation in Kampala, Uganda; and Michael Potts of Catholic Relief Services in Nairobi, Kenya. Details on the winning solutions are available at www.intel.com/pressroom.
Intel Developer Forum
IDF spans the worlds of mobility, digital enterprise, digital home and technology and research. The Beijing IDF, as announced in December, was scaled back from a two-day event due to current economic circumstances and business pressures the industry is facing globally. Next up on the IDF schedule is a three-day event in San Francisco, which will be held Sept. 22-24 at Moscone Center West. Further information is available by visiting http://developer.intel.com/idf.
Intel [NASDAQ: INTC], the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com.
